Processes: HASL, Au plating, Au/SP immersion and OSP
Layers: 1 to 32
Fabrication, hand insertion, metal assembly and function test
Conventional coatings: 0201, 0402, 0603, 0805, 1210 and 2512 placement
BGA minimum precision: 0.5mm
IC minimum precision: 0.4mm
Experienced components sourcing team
Specially for scarce parts
1 to 22 layers mixed assembly technology, specialized in assembling boards for safety, industry control and power boards
Type of production line and support:
SMT (Yamaha and Sanyo machine)
Plastic injection factory
Die-cast and sheet metal stamping factory
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